Optical Microscope (OM) Testing Services
The optical microscope uses the magnifying imaging principle of convex lens, and the best resolution is 0.2μm. Because visible light is used as the light source, the optical microscope is very sensitive and accurate for color recognition. It can observe not only the surface tissue of the sample, but also the tissue in a certain range below the surface.
Because of its convenient operation, intuition and high verification efficiency, optical microscope is suitable for surface observation and measurement. It can not only identify and analyze the surface defects of all kinds of metal, alloy and non-metallic products and the inspection of surface phenomena such as integrated circuit, printed circuit board, wire, fiber and surface spraying, but also can be widely used to observe opaque and transparent substances in electronic, chemical and instrumentation industries.
As a professional reliability third-party testing organization, T,C&A Lab's Optical Microscope (OM) Testing Lab can provide the following services according to ISO, ASTM and other standards. Welcome to contact our experts for consultation.
Our optical microscope laboratory can provide the following services:
- Failure analysis
- Brittle fracture
- Plastic fracture
- Visual inspection
- Size measurement
In failure analysis, it is very important to show and identify the micro-morphology of the fracture. Because different morphological features are produced by different fracture mechanisms, through the identification of morphological features, the properties of the fracture can be identified, which is helpful to the failure cause analysis.
In the process of failure analysis, the morphology of the sample is mainly observed and recorded by the optical microscope, which can provide several times to thousands of times of magnification. In addition, the optical microscope is transparent to some multilayer structures of semiconductors, such as the passivation layer of silicon dioxide. The optical microscope requires the sample to be solid, and the surface of the sample is required to be flat due to the limitation of depth of field in high-power observation.
When using a microscope, it is generally to observe the overall morphology and defects through a low-power microscope, and then use a high-power microscope to further confirm the defects, such as cracks, fractures, contamination, deformation and other abnormalities.
The optical microscope can provide the basis for the following failure analysis, such as:
This is a common type of failure analysis, which occurs when the applied stress is lower than the yield strength of the material, and belongs to low stress failure. The main morphologies that can be seen under the microscope are fatigue strips, tire tracks, cleavage fans, intergranular brittle separation and structural equality.
Observing this type of fracture under an optical microscope, what can be displayed is mainly dimple patterns.
Various industries are paying more and more attention to issues such as appearance, and the requirements for product manufacturing processes are becoming more and more stringent. The rating of product appearance largely reflects product quality. By using the optical magnification auxiliary device to check the product shape, assembly, whether there are cracks, holes and poor welding on the surface, and to inspect the process of the production line, the quality of the printed circuit board and the welding defects in the circuit assembly, it is helpful to monitor the manufacturing process, take corrective measures to the inspection results in time, and provide guidance for the operation of the production process and product quality assurance, and ensure that the product meets the shape, coordination and functional requirements in the end-use environment.
According to the use characteristics of the parts, the acceptance standard generally includes three conditions: ideal condition, acceptance condition and rejection condition. It is mainly used in the verification of tooling, metal parts, electronic product assembly, offset, welding anomaly inspection, PCB/PCBA line, anti-welding, hole, part alignment and text and graphic defect inspection.
Size measurement is the basic measure to measure the quality of materials. The physical quantity measured is compared with the standard unit quantity. It is convenient to analyze and find out the reasons for the abnormal size image, which is helpful to obtain the actual size, inspect the product quality and control the process flow accurately.
Compared with the traditional manual measurement and mechanical measurement, the optical dimension measurement has high accuracy (generally up to 0.01mm), high speed (about 100ms), objective, reliable, high repeatability, non-contact and no damage. It is mainly used in machinery, tool prototypes, machines and other small and medium-sized accessories, moulds and other industries, gear, cam, worm and other industries. In the electronics industry, it is mainly used for the measurement of inner and outer dimensions (length, width, thickness, inner diameter and outer diameter), hole distance, height and depth, connector pin spacing, testing coplanarity, etc., of electronic components and PCB/PCBA products.
Instruments and data
Beng, Y. K.; et al. Brittle Fracture Validation Through Crystallographic Deformation for the Characterization of Cleavage in Carbon Steel[J]. Journal of Applied Sciences, 2007, 7(15):398-422.
Note: this service is for Research Use Only and Not intended for clinical use.
- Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES)
- X-Ray Fluorescence (XRF) Testing
- X-Ray Photoelectron Spectroscopy (XPS) Testing
- Infrared Spectroscopy Testing
- Ultraviolet Spectrum (UV) Testing
- Mass Spectrometry Testing
- Micro-Raman Spectroscopy Testing
- Nuclear Magnetic Resonance Spectroscopy Testing
- Elemental Analysis
- Structural Characterization
- Morphology & Size Analysis
- Corrosion Inhibitor Testing
- Crevice Corrosion Testing
- Electrochemical Corrosion Testing
- Galvanic Corrosion Testing
- High Pressure High Temperature (HPHT) Corrosion Testing
- Hydrogen Embrittlement Testing
- Intergranular Corrosion (IGC) Testing
- Pitting Corrosion Testing
- Salt Spray Testing
- Sour Service Corrosion Testing
- Stress Corrosion Cracking (SCC) Testing
- Sulfide Stress Cracking (SSC) Testing
- Thermal Analysis
- Mechanical Testing
- Non-Destructive Testing
- Performance Testing
- Pharmaceutical Testing
- Chemical Analysis
- Case Depth Testing and Analysis
- Grain Size Analysis
- Particle Size Distribution Analysis and Testing
- Coating Thickness Testing
- Inclusion Rating
- Ferrite Testing
- Porosity Testing
- Grain Flow Testing and Analysis
- Weld Testing
- X-Ray Diffraction (XRD) Analysis
- Scanning Electron Microscopy (SEM) Laboratory
- Harmful Substances Testing
- Reverse Engineering & Deformulation
- Industrial Problem Diagnosis
- Ingredient Analysis